Pin grid array

The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors. The integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a sqaure array of metal pins. The pins can then be inserted into the holes in a printed circuit board and soldered in place. They are almost always spaced a tenth of an inch (2.54mm) apart. For a given number of pins, this type of package occupies less space than older types such as the dual in-line package (DIL or DIP).

The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentium processors, and are often used on motherboards with ZIF sockets to protect the delicate pins.